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Ships within 48 hours · Estimated delivery Aug 4 - Aug 9
Bottom Inside Dimensions L x W x H: : 24
Display: Temperature & Air Flow
OAL: 120 / 4
Diameter: 90 mm (3
Outer Dimensions: 21
AIM NC520-SAC305-T4 Lead Free No Clean Solder Paste, 500 Gram Jar (10 jars) Quad Bottom Inside Dimensions L xAIM NC520 is designed for the most demanding high density electronic assemblies. NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding. The superior wetting ability of NC520 results in bright, smooth and shiny solder joints with SAC alloys. An innovative activator system offers excellent wetting in a wide range of profiles. Enhanced wetting will reduce voiding on QFN ground planes, LGA and BGA interconnects.
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